Eliyan raises $60M for chiplet interconnect to speed up AI chips

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Eliyan raised $60 million in funding for its chiplet interconnect technology, which accelerates processing speeds in AI chips.

Samsung Catalyst Fund and Tiger Global Management both led this round of financing to help the team meet the challenges of generative AI chip development. Market research firm Arete Research said that driven by demand for AI chips, industry forecasters expect strong growth in the high-bandwidth memory (HBM) field, with growth as high as 331% this year and 124% in 2025.

Eliyan’s UCIe, BoW or UMI compliant PHYs (called NuLink PHYs) address memory and IO wall limitations on premium or standard packaging materials. PHY is the physical layer of the OSI model. Instances of PHY connect link layer devices (often called MACs) to physical media, such as fiber optic or copper cables. It is now being used in multi-chip solutions, allowing chipmakers to connect multiple chiplets on the same device.

Eliyan’s chiplet interconnect technology can deliver up to four times the performance of other solutions while consuming half the power, the company said.

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Validated on advanced process nodes, NuLink PHY solves chip-to-chip and chip-to-memory interconnect problems with efficient performance metrics.

Existing investors also participated in the round, including Intel Capital, SK Hynix, Cleveland Avenue and Mesh Ventures, among others.

This additional investment follows the company’s $40 million Series A funding round in 2022. This will allow Eliyan to continue to focus on the most pressing challenges in the design and manufacturing of advanced AI chips using multi-chip architectures in advanced packages or standard organic substrates. Its chiplet interconnect technology enables chipmakers to achieve new levels of performance and power efficiency.

In addition to chip-based interconnects in chiplet designs, the company is addressing the growing challenges of memory capacity and bandwidth in AI chips with its innovative Universal Memory Interface (UMI). The bidirectional interconnect approach targets the “memory wall” problem faced by large multi-chip designs.

Co-founder of Elijan.
Co-founder of Elijan.

Marco Chisari, head of Samsung’s Semiconductor Innovation Center, said in a statement: “We are pleased to co-lead Eliyan’s Series B financing with an outstanding team known for their unique expertise in interconnect and mixed-signal technologies. Collaboration.” “Intensive workloads and cutting-edge applications, including generative artificial intelligence and automotive, are driving the need for more complex semiconductor designs and the adoption of chiplet architectures.”

UMI enables very efficient bandwidth memory connections in standard organic substrates and advanced packaging. Given its efficient PHY waterfront area, UMI significantly increases the aggregate memory bandwidth per AI chip and reduces the major chip area required for memory interfaces. Read more about UMI here.

“The explosion of artificial intelligence is driving growing connectivity needs, and the semiconductor industry is undergoing a dramatic transformation with the rise of multi-chip implementations, Eliyan is poised to revolutionize chiplet connectivity by unleashing the ultimate performance of chiplet-based systems technology,” Srini Ananth, managing director at Intel Capital, said in a statement. “Eliyan’s continued advancements in chip-to-chip interconnect architecture and its scalability in the era of artificial intelligence truly mark a major milestone in the larger chiplet revolution.”

Eliyan’s NuLink PHY was recently tape-out on TSMC’s 3nm process, targeting industry-leading performance of up to 64Gbs per link with an unprecedented performance/power ratio.

“This investment reflects our confidence in our approach to integrated multi-chip architectures that address critical issues such as high cost, low yields, power consumption, manufacturing complexity and size constraints,” Eliyan CEO Ramin Farjadrad said in a statement. challenge.” “Our NuLink technology has been commercialized and tape-outed on a state-of-the-art process and is optimized to deliver the necessary high bandwidth, low latency and low power capabilities. We thank all investors Support for our vision of building the ultimate system-on-a-chip for the new era of artificial intelligence.”

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